Sinocure Chemical Group Co.,Ltd.

SINOMER® PM839: Low-Temperature Rapid Curing Agent for Epoxy Resins & Photovoltaic Applications

Discover SINOMER® PM839, a low-temperature epoxy curing agent for electronics, coatings, and PV silicon cutting. Enhance efficiency and reduce costs. Request a sample today!Can replace Capcure 3-800;GABEPRO GPM-800;Polythiol QE-340M.
Introduction

SINOMER® PM839 is a thiol-terminated polymer curing agent (CAS 72244-98-5) engineered for fast, energy-efficient curing in epoxy resin systems. As a sustainable alternative to traditional agents like Capcure 3-800, it delivers rapid crosslinking with minimal environmental impact, making it ideal for electronics, coatings, and photovoltaic (PV) silicon rod cutting adhesives,Can replace Capcure 3-800;GABEPRO GPM-800;Polythiol QE-340M.


Key Benefits
  • Rapid Curing: Achieves full cure at 25–40°C within 1–2 hours, slashing production downtime.
  • Low Shrinkage (<1%): Reduces stress-induced defects in delicate applications like PV wafer processing.
  • High Adhesion: Bonds strongly to metals, ceramics, and silicon (tested per ASTM D4541).
  • Eco-Friendly: Halogen-free (Cl ≤800 ppm), RoHS/REACH compliant, and low-VOC (<1.2%).

Applications
Electronics Encapsulation
    • Potting compounds for circuit boards, ensuring moisture and thermal resistance.
    • Example: Cures at 25°C in 2–4 hours, enabling high-throughput manufacturing.
  1. Anticorrosive Coatings
    • Marine/industrial coatings with enhanced chemical resistance.
  2. Photovoltaic Silicon Rod Cutting Adhesives (Target Long-Tail Keyword)
    • Precision bonding for diamond wire sawing of silicon wafers.
    • Performance Highlights:
      • Reduces wafer breakage to <0.5% (vs. 1.5–3% industry average).
      • Resists glycol-based coolants and 120°C cutting heat.
  3. Jewelry & Craftwork Bonding
    • Clear, non-yellowing bonds for delicate materials.

Technical Specifications
Property Value
Appearance Colorless transparent liquid
Viscosity (25°C) 12,000–14,000 mPa·s
Mercapto Equivalent ≥3.0
Storage Stable under nitrogen, 12-month shelf life

Case Study: PV Wafer Manufacturer Efficiency Boost
  • Challenge: 2.8% wafer breakage due to adhesive stress.
  • Solution: Adopted SINOMER® PM839-based adhesive.
  • Results:
    • Breakage reduced to 0.4%; annual savings: $150,000.
    • 20% faster production via 1–2 hour curing at 30°C.

Why Choose SINOMER® PM839?
  • Cost Efficiency: 30% lower energy use vs. high-temperature curing.
  • Performance: Exceeds ASTM/ISO benchmarks for hardness (≥3H) and thermal stability.
  • Sustainability: Aligns with global green manufacturing standards.

Get Started Today!

Optimize your epoxy or PV adhesive process with SINOMER® PM839.
📧 Contact Usinfo@sinocurechem.com | 📞 +86 15668330235

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